The development direction of thermal conductive materials

^{The development direction of thermal conductive materials}

Nowadays, with the development of technology, electronic devices can be said to be changing with each passing day, and the appearance of electronic devices and terminals is increasingly demanding to develop thinner, so the electronic thermal materials that follow them are getting smaller and smaller. Aspect development.

With the rapid development of microelectronics technology, the size of the chip is getting smaller and smaller, and the computing speed is getting faster and faster, and the heat is getting bigger and bigger. For example, the Intel processor 3.6G Pentium 4 Ultimate Edition generates the most heat when it runs. Up to 115W, which puts higher demands on the heat dissipation of the chip. Designers must use advanced heat-dissipation processes and high-performance heat-dissipating materials to effectively remove heat and ensure that the chip can operate at the highest temperature it can withstand. TVs have evolved from CRT to LCD flat-panel TVs, desktop computers to laptops, digital set-top boxes, portable CDs, etc. The heat dissipation design is different from the traditional ones, because these products are relatively small.

Statistics show that for every 2 degrees increase in temperature of electronic components, the reliability is reduced by 10%; when the temperature rises by 50 degrees, the lifetime is only 1/6 of that when the temperature rises by 25 degrees. Temperature is the most important factor affecting equipment reliability. This requires technical measures to limit the temperature rise of the chassis and components, which is the thermal design. The principle of thermal design is to reduce the heat generation, that is, to select better control methods and technologies, such as phase shift control technology, synchronous rectification technology, etc., in addition, to select low-power devices, reduce the number of heat-generating devices, and increase The width of the rough line increases the efficiency of the power supply. The second is to strengthen heat dissipation, that is, to transfer heat by conduction, radiation, and convection techniques.

However, for a product with a flat appearance, first of all, it is not possible to use more heat-dissipating aluminum sheets and fans from the space, and as a whole, it is not allowed to strengthen the cooling heat-dissipation design, and the convection form cannot be used. The same way of radiating heat is also difficult to achieve in a flat space. Therefore, everyone has thought of using the chassis to dissipate heat. The advantage is that you don't consider adding a fan power supply due to the fan. There is no more dust caused by the fan, and there is no noise caused by the fan.

How can we really make good use of the heat dissipation of the machine casing? The opportunity for the application of flexible silicone thermal insulation materials is coming. The soft thermal conductive silicone insulating mat is one of the heat transfer interface materials, is a sheet material, can be arbitrarily cut according to the size and shape of the heating power device, has good thermal conductivity and insulation properties, and its function is to fill the heating power device. The gap between the heat sink and the heat sink is the best alternative to the binary heat dissipation system of thermal grease and mica (insulation). The thermal conductivity of this product is 2.45W/mK, while the thermal conductivity of air is 0.03w/mk; the voltage breakdown resistance is above 4000 volts, and insulation requirements can be used in most electronic equipment.

The thickness of the process varies from 0.5mm to 5mm, 0.5mm per 0.5mm, ie 0.5mm 1mm 1.5mm 2mm up to 5mm, special requirements can be increased to 10mm, the thickness is different for the designer to choose PCB board and heating power device s position. Flame-retardant and fire-retardant performance meets UL 94V-0 requirements and complies with EU SGS environmental protection certification. The working temperature is generally between -50 °C and 220 °C. Therefore, it is a very good thermal conductive material. It is also very soft and specially designed to transfer heat through the gap. The design scheme can produce gaps, complete the heat transfer between the heat generating part and the heat radiating part, increase the heat conducting area, and also play the role of damping insulation sealing, etc. New thermal materials for sex and usability. And the thickness is applicable to a wide range of applications, especially for the electronic equipment industry such as automobiles, displays, computers and power supplies.

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