Thermal pad selection application

As a kind of common thermal conductive material, thermal pad has many types and wide applications. There are many factors to consider when choosing an application. Therefore, it is necessary to develop a suitable and perfect thermal pad selection application program to better adapt to production and application. demand.

Based on years of experience in the field of electronic thermal conductivity, Gold-cool.com has summarized the basic steps and solutions for the selection of thermal pad applications, including:

1. Formulation of thermal conductivity scheme

At present, the heat conduction form of electronic products mainly includes two kinds of traditional heat conduction sheets and structural heat conduction parts, and according to the characteristics of the products, a heat conduction form with high cost performance and high operability is selected.

If the thermal conductive sheet is used for heat conduction, it is not suitable to use a thermal conductive tape with a low thermal conductivity, and the thermal conductivity silicone grease with high thermal conductivity is not suitable because it does not have anti-seismic properties. It is recommended to use a metal hook or plastic with a thermal pad for heat conduction, which is better.

When using structural heat-conducting parts, it is necessary to consider the structural form of the structural parts at the contact surface, local avoidance, etc. The size of the selected thermal pad and the structural process should be balanced, and the thinner thermal pad should be selected as much as possible. In actual production, in order to operate Further simplification, generally one-sided adhesive is used for bonding, and factors such as component position and package form need to be comprehensively considered.

Based on the above factors and precautions, develop a suitable product thermal conductivity plan.

2, the choice of thermal materials

After the thermal conductivity scheme is formulated, it is necessary to select the thermal pad to be used, mainly considering thermal conductivity, size and thickness.

Depending on the application location, a thermal pad with a suitable thermal conductivity, such as a chip that is sensitive to temperature and has a relatively high heat flux density, requires a thermal silica film with a high thermal conductivity to meet the heat dissipation requirements.

The size of the thermal pad should be based on the heat source. The use of a large thermal pad does not improve the thermal conductivity. In addition, the thickness of the thermal pad is related to the hardness, density, compression ratio, etc. The specific thickness can be based on actual test results. determine.

Relative to the above factors, other factors such as volume resistance, surface resistance, dielectric constant, and breakdown voltage are not required when selecting, and the basic requirements can be met.

In short, the development of thermal pad selection application plans to consider the thermal conductivity requirements, material costs, production processes and other aspects, and requires the developers to have a wealth of industry experience. For more information on thermal pad selection and application, please contact customer service at gold-cool.com. Gold-cool.com has many years of experience in the field of electronic thermal conductivity, because of the focus, so professional!