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  • GC-GL100
GC-GL100
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Gap filler


This product is a one-component, pre-formed, and ultimately non-flowing, non-curable plastic heat conduction product.

The product mainly meets the requirement of low stress and high compression modulus when it is used, and can realize self-reliance.
Motorized production, good contact with electronic product assembly, showing low contact heat

Resistance and good electrical insulation characteristics


Feature:
●High thermal conductivity 
●Low compression applications
●Excellent electrical insulation
●Superior temperature resistance
●Applied for automatic production line


Application:
●LED chips
●Comunication eauipment
●Phone CUP
●Memory module
●IGBJ and other power modules
●Power semiconductor field
●LED lights
●Other electronic components

Typical Properties:


ProjectUnitGL100Testing   Standard
Color-WhiteVisual
Densityg/cm32.1ASTM D792
Thermal ConductivityW/m.K1ASTM D5470
Minimum Thicknessmm0.1ASTM D374
Thermogravimetric Loss%1@150/240H
Temperature Range-40200/


Dongguan Gold-cool Nano Technology Co., Ltd.

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