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  • GC-GL200
GC-GL200
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0769-82101656

Gap filler
This product is a one-component, pre-formed, and ultimately non-flowing, non-curable plastic heat conduction product.
The product mainly meets the requirement of low stress and high compression modulus when it is used, and can realize self-reliance.
Motorized production, good contact with electronic product assembly, showing low contact heat
Resistance and good electrical insulation characteristics


Feature:
●High thermal conductivity 
●Low compression applications
●Excellent electrical insulation
●Superior temperature resistance
●Applied for automatic production line


Application:
●LED chips
●Comunication eauipment
●Phone CUP
●Memory module
●IGBJ and other power modules
●Power semiconductor field
●LED lights
●Other electronic components


Typical Properties:


ProjectUnitGL200Testing   Standard
Color-Light BlueVisual
Densityg/cm32.7ASTM D792
Thermal ConductivityW/m.K2ASTM D5470
Minimum Thicknessmm0.1ASTM D374
Thermogravimetric Loss%1@150/240H
Temperature Range-40200/


Dongguan Gold-cool Nano Technology Co., Ltd.

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