Gap filler

This product is a one-component, pre-formed, and ultimately non-flowing, non-curable plastic heat conduction product.
The product mainly meets the requirement of low stress and high compression modulus when it is used, and can realize self-reliance.
Motorized production, good contact with electronic product assembly, showing low contact heat
Resistance and good electrical insulation characteristics

Application:
●LED chips
●Comunication eauipment
●Phone CUP
●Memory module
●IGBJ and other power modules
●Power semiconductor field
●LED lights
●Other electronic components