Heat conductive materials and properties commonly used in electronic products

       Heat conducting material is the auxiliary material of electronic products, which is used to solve the heat dissipation problem of electronic products, so as to improve the operation speed, reliability, stability and service life of electronic products. It is an indispensable part of electronic products.

Why do electronic products use heat conducting materials?

1. There are very small uneven gaps between the surface of electronic materials and the radiator. If they are installed together directly, the actual contact area between them is only 10% of the area of the radiator base, and the rest are air gaps. Because the air thermal conductivity is only 0.024w / (m.k), which is a bad conductor of heat, the contact thermal resistance between the electronic components and the radiator is very large, which seriously hinders the heat conduction, resulting in the low efficiency of the radiator.

2. Filling these gaps with heat conducting materials with high thermal conductivity, removing the air, and establishing an effective heat conduction channel between the electronic components and the radiator can greatly increase the effective contact area between the heat source and the radiator, reduce the contact thermal resistance, and make the radiator fully play its role.

What are the types of heat conducting materials?

1. Heat conductive silica gel sheet

     In the industry, also known as thermal conductive silicone pad, thermal conductive silicone film, soft thermal conductive pad and so on, are specially produced for the design scheme of using the gap to transfer heat, enough to fill the gap, complete the heat transfer between the heating part and the cooling part, and also play the role of insulation, shock absorption, sealing, etc., which can meet the design requirements of miniaturization and ultra-thin equipment, is highly technological and used It is a good heat conduction filling material. In the design, it can reduce the technological requirements of radiator and heat dissipation structure, and it is simple and convenient in construction and can be reused.

2. Thermal silicone grease

     Thermal conductive silicone grease has high cost performance, which is a common thermal conductive material in electronic heat dissipation. The thermal conductive organosilicone grease composite is made of organosilicone as the main raw material, adding materials with excellent heat resistance and thermal conductivity. It is used for thermal conduction and heat dissipation of power amplifiers, transistors, electronic tubes, CPUs and other electronic devices, so as to ensure the stability of electrical and gas properties of electronic instruments and meters. However, the operation is not very convenient. The general heat transfer paste will have silicone oil precipitation, which will dry solid and pulverize after a long time, and lose the heat transfer effect. Therefore, it is not recommended to use heat transfer paste for electronic products with long service life.

3. Heat conductive double-sided adhesive

     Heat conductive double-sided adhesive is composed of acrylic polymer filled with heat conductive ceramic powder and organic silica gel adhesive. It has the characteristics of high heat conduction and insulation, and has softness, compressibility, adaptability and strong viscosity. It can adapt to a wide range of temperature, can fill up the uneven surface, can closely and firmly fit the heat source device and heat sink, and can quickly transmit the heat out. It is mainly used for bonding the heat sink and heating equipment. The construction method is very simple and convenient. Only the heat conduction double side is pasted between the heat sink and the heat sink, and the heat sink is firmly fixed on the heat sink. The use is simple and convenient, which is conducive to improving the production efficiency. Its heat dissipation effect is more obvious than that of ordinary heat dissipation stickers, which greatly improves the life of components. It is the first choice of some high-end electronic products that need heat conduction. It should be noted that the bonding surface must be clean and not suitable for bonding printed and electroplated surfaces.

4. Thermal mud

    The application process of heat transfer mud can be made into high compression ratio sheet products or semi flow state to meet the requirements of automatic dispensing process, not limited by the shape and size of electronic components. It has high efficient heat conduction effect and excellent caulking effect.

5. Heat conduction potting adhesive

    Heat conduction potting adhesive is suitable for potting electronic components with high heat dissipation requirements. After curing, the adhesive has good thermal conductivity, excellent insulation, excellent electrical performance, good adhesion and good surface luster.

6. Heat conducting graphite sheet

    The crystallization of special process and advanced technology, extraordinary thermal conductivity and low resistance are the materials used in special occasions. Their thermal conductivity and flexibility of the material itself well meet the requirements of heat dissipation and installation of power devices. With high thermal conductivity, thin material, high cost performance and strong longitudinal thermal conductivity, the hot spot area can be quickly removed. However, it should be noted that the heat conducting graphite sheet is not insulated, the material is brittle, and the loss is large when punching.

      Dongguan Gold-cool Nano Technology Co., Ltd., a national high-tech enterprise, has been insisting on independent research and development in the field of heat conduction and heat dissipation materials for many years, and has a number of patents. It is a high-tech enterprise integrating design, research and development, production and sales one-stop service. The company's heat conduction and heat dissipation products include: heat conduction silica gel sheet, heat conduction double-sided adhesive, heat conduction silicone grease, heat conduction mud, heat conduction potting adhesive, heat conduction silica gel cap cover, etc. Welcome to inquire: 400-6235-169