Advantages and Application Areas of Thermal Conductive Silicon Films

 What is thermal conductive silica gel?

Heat conducting silica gel sheet is a kind of heat conducting medium material synthesized by special process with silica gel as base material and various auxiliary materials such as metal oxide. Heat conducting silica gel sheet only plays a heat conducting role, forming a good heat conducting path between the heating body and the heat dissipation device, and forming a heat dissipation module together with the heat sink and the structural fixings

The following materials are required for the fabrication of thermal conductive silica gel:

1. Silicone resin

2. Insulating and heat conducting filler: aluminum oxide, magnesium oxide, boron nitride, aluminum nitride, beryllium oxide, quartz and other organosilicon plasticizers

3. Flame retardant: magnesium hydroxide, aluminum hydroxide

4. Crosslinking agent

5. Catalyst

 Why use thermal conductive silica gel?

1. The main purpose of selecting thermal conductive silicon film is to reduce the contact thermal resistance between the surface of heat source and the contact surface of radiator

2. The thermal conductive silicone sheet can well fill the gap between the contact surfaces, extrude the air out of the contact surface, and the air is the bad conductor of heat, which will seriously hinder the heat transfer between the contact surfaces; with the supplement of the thermal conductive silicone sheet, the contact surfaces can be fully contacted better, and the face-to-face contact can be truly achieved. The reaction on the temperature can reach the minimum temperature difference.

3. Thermal conductive silicon film has the following advantages and properties.

(1) Range and stability of thermal conductivity

(2) To reduce the requirements of process difference of radiator and cooling structure

(3) Insulation performance

(4) Shock absorption effect

(5) Ease of installation, testing, and reuse

(6) Reduce the requirements of process difference of radiator and heat dissipation structure

(7) The thickness and hardness of the heat-conducting silica gel sheet can be adjusted according to the design. Therefore, in the heat-conducting channel, the size difference of the heat dissipation structure and the chip can be bridged, and the work difference requirements for the contact surface of the radiator, especially for the flatness and roughness, can be reduced, If the processing accuracy is improved, the product cost will be increased to a large extent. Therefore, the contact area between the heat generator and the heat sink can be fully increased and the production cost of the radiator can be reduced.

      In general, the heat-conducting silica gel sheet is a stable solid, with optional strength, convenient disassembly and elastic recovery.

 How to use heat conductive silica gel correctly?

Generally, thermal conductive silicon film should be added to the structure design, hardware and circuit design at the beginning of design. Generally, factors to be considered include: thermal conductivity, structure, EMC, vibration and sound absorption, installation and test, etc.

1. Choose the heat dissipation scheme: electronic products are developing towards the trend of being short and light. Generally, passive heat dissipation is adopted, and the traditional heat sink scheme is the main one; the current trend is to cancel the heat sink and adopt structural heat sink (now belongs to bracket, metal shell); or combine the heat sink scheme and heat sink structure scheme; under different system requirements and environments, choose the scheme with the best cost performance

2. If the heat sink scheme is adopted, it is recommended to use metal hook or plastic pushpin for operation, and choose 0.5mm thick heat-conducting silicon film for use. This scheme is easy to install and operate, with good heat dissipation effect, safety and reliability, and good quality and low price.

3. When selecting the heat dissipation structure, it is necessary to consider the local protrusion and avoidance of the heat dissipation structure on the contact surface, and balance the structure process and the size selection of heat conduction silicon film. It is recommended not to select the specially thick conductive silica gel sheet as far as possible when the process allows. In general, it is recommended to use single-sided gluing for operation convenience, and stick the glued surface on the heat dissipation structure; here, the one with good compression ratio shall be specially selected to ensure that a certain pressure is applied to the heat conduction silica gel sheet.

4. Reference for selection of other parameters

(1) The best choice for the size of thermal conductive silicon film is to cover the heat source, rather than the contact surface of the radiator or heat dissipation structure. When the size is larger than the heat source, it will not greatly improve or improve the heat dissipation.

(2) The thickness selection of thermal conductive silicon film is related to the density, hardness, compression ratio and other parameters of the product. It is recommended to determine the specific parameters after the sample test.

(3) The breakdown voltage, dielectric constant, volume resistance, surface resistivity and so on can meet the requirements, especially the peak value is the best.

(4) In consideration of product cost sharing, cost reduction and other factors, it is recommended to select the existing specifications and models of thermal silicon chip manufacturers in the design, and directly select the common specifications without special treatment or shape. At this time, PCB layout, radiator shape, thermal structure shape, etc. should be considered.

 Application field of thermal conductive silicon film.

1. LED light industry

2. Aluminum base plate

3. Laptop

4. LCD, PDP TV: control chip, between transformer and shell, radiator,

5. Power supply: between triode and heat sink, between heat sink and shell, between transformer and shell

6. Blu ray DVD, set top box: between IC and radiator, between IC and housing

7. Radiator module: bottom of radiator

Dongguan Gold-cool Nano Technology Co., Ltd., a national high-tech enterprise, has been insisting on independent research and development in the field of heat conduction and heat dissipation materials for many years, and has a number of patents. It is a high-tech enterprise integrating design, research and development, production and sales one-stop service. The company's heat conduction and heat dissipation products are: heat conduction silica gel sheet, heat conduction double-sided adhesive, heat conduction silicone grease, heat conduction mud