New Heat Dissipation Mode of Electronic Equipment in 5G Era

Light, ultra thin, intelligent and multi-functional equipment increase heat dissipation requirements

      Heat conduction material is a new type of industrial material designed for the heat conduction requirements of equipment. They have proper countermeasures for the possible heat conduction problems, provide powerful help for the high integration of equipment and ultra-small and ultra-thin. Heat conduction products have been more and more applied to many products, improving the reliability of products. For electronic equipment, the higher the reliability, the longer the trouble free working time, so as to improve the product competitiveness and enhance the user experience.

     Heat conducting materials are mainly used to solve the thermal management problems of electronic equipment. The heat generated in operation will directly affect the performance and reliability of electronic products. It has been proved that the reliability of electronic components decreases by 10% when the temperature of electronic components increases by 2 ℃, and the life of electronic components when the temperature rises by 50 ℃ is only 1 / 6 of that when the temperature rises by 25 ℃. With the volume of IC chips and electronic components shrinking, the power density of IC chips and electronic components is increasing rapidly.

     Heat conduction, convection and radiation are three basic ways of heat transfer. In the process of heat transfer, according to the different radiator structure, heat transfer will be combined with heat conduction, convection and radiation. The principle of heat dissipation of electronic products is to take the heat from the heat producing device into the radiator through the heat conduction interface material, and finally to disperse the heat to the external environment, so as to reduce the temperature of electronic products.

     The heat conduction material is used between the contact interface of the heat source and the radiator to improve the heat conduction efficiency, so as to effectively solve the heat dissipation problem of the whole high-power electronic equipment. With the continuous progress of science and technology, electronic equipment products gradually show two development trends: first, the integrated functions on a single device gradually increase and complicate; second, the volume of the product itself gradually shrinks. Both of these changes put forward higher requirements for the thermal management technology of electronic equipment, such as the thermal conductivity of thermal conductive materials and the thermal stability of long-term work. At present, the widely used thermal conductive materials include synthetic graphite materials, thermal conductive interstitial materials, thermal conductive gels, thermal conductive silicone grease and phase change materials.

      Dongguan Gold-cool Nano Technology Co., Ltd., a national high-tech enterprise, has been insisting on independent research and development in the field of heat conduction and heat dissipation materials for many years, and has a number of patents. It is a high-tech enterprise integrating design, research and development, production and sales one-stop service. The heat dissipation products produced by the company include: thermal conductive silica gel, thermal conductive double-sided adhesive, thermal conductive gel, graphite sheet, thermal conductive silicone grease, heat conductive mud, thermal conductive potting adhesive, etc., which can provide one-stop heat conduction and heat dissipation solutions for electronic equipment in the era of 5G. Welcome to inquire: 400-6235-169